M2M Semiconductor Chip Personalization Machine

Machine-to-Machine (M2M) semiconductor chip personalization machines are specialized devices used in the production and personalization of M2M chips. These chips are used in various applications, including IoT devices, industrial automation, and vehicle telematics.

Types of M2M Semiconductor Chip Personalization Machine

SCM3000 M2M Chip Personalization Machine

SCM200 M2M Chip Personalization Machine

DCP500 M2M Chip Programming Machine

The M2M semiconductor chip making machine can conduct chip electrical performance test, chip encoding and surface laser marking for M2M chips in QFN, DFN, VSOP8 and other packaging forms, automotive electronic SE (Security Element), eSIM and other smart devices.

SCM can provide high-speed, stable, and safe personalization production services for global mobile operators, smart device OEMs, and automotive electronic security chip manufacturers. Since 2017, the chip manufacturing equipment we have provided to dozens of factories has produced nearly 500 million chips, reflecting our commitment to providing customers with high-quality solutions.

Parameter of M2M Semiconductor Chip Personalization Machine

Item Machine name Capacity Overall dimensions Weight Power supply Compressed Air

1 SCM3000 2500/uph 1850mm X 1600mm X 1750mm 600kg 220V（-5%~+10%, 50Hz, 6KW Pressure:0.5Mpa

2 SCM200 1000/uph 1250mm×950mm×1870mm 450Kg 220V(-5%～+10%), 50Hz, 3KW Flow rate:300LPM

3 DPC500 500/uph 1210mm×930mm×1880mm 500kg AC220V(-5%~+10%), 50Hz, 0.5kW

Noise: ＜65dB; Working temperature;23℃±3℃; Working humidity: 50±10%

Working Process of Semiconductor Chip Personalization Machine

Workflow 1: IC writing

Standard: 16 reading and writing stations, including 4 Perteco 4-in-1 contact readers PT204PT-AMA.

Scalable configuration to: 32 read/write stations, including 8 Perteco 4-in-1 contact readers PT204PT-AMA.

It can write personalized data to the chip, support ISO7816, serial port, Bluetooth, SPI and I2C protocols, and realize online card filling function.

Workflow 2: Laser marking

One 20W fiber laser marking machine is configured.

Equipped with one smoke purifier.

Using the self-developed special laser marking machine, the surface personalized information laser marking of 2 chips can be carried out at the same time to improve the marking efficiency.

Semiconductor Chip Personalization Machine

OCR Verification Module:

01

Equipped with a set of 5 million pixel industrial camera (including light source).

02

Equipped with a set of OCR software.

Surface information of chips can be recognized and verified.

M2M Semiconducto Chip Personalization Machine FAQs

FAQS

What is the downtime for equipment failure?

Hundred-hour downtime should not exceed 30 minutes.

How long does it take to switch between different specifications of chip production?

The switch only takes 20 minutes.

Which core components on the equipment are independently developed and produced by the company?

The 4-piece 4-in-1 contact reader PT204PT-AMA on the IC writing unit is independently developed and produced by Pelteco The dedicated laser marking machine of the laser marking unit is independently developed and produced by Pelteco, which can carry out laser marking of surface personalized information on 2 chips at the same time to improve the marking efficiency The configuration of the Visual verification Unit (OCR) 1 set of visual recognition system is independently developed and produced by Pelteco.

If you want to know more about smart chip card solutions, please visit our website.