1. FR-4 PCB, up to 30 Layers, 0.3-4.8mm thick, 1-5 oz heavy copper, High Tg 170 & 180, Differential /single impedance contorl, 1+C+1 HDI, 0.1mm drill, 40 microinch gold finger, peelable mask ENIG, HASL, Silver, OSP technology Small to medium volume, No MOQ. 24 hours fast turnaround prototypes etc. 2. XPC(94HB), FR-1(94V0), single sided PCB, large volume, OSP, Electro Gold finish, Punch contour. 3. CEM-1 and CEM-3, Single sided, large volume, OSP, Electro gold, HASL technique. 4. MCPCB includes aluminium backed, Bergquist T-CLAD, Laird 1KA. Copper backed and Stainless steel backed material. 5. Microwave PCB includes PTFE, RO4350B/4003C, Duriod6002 and TLY-5 6. Solder paste stencil, laser cut, aluminium framed, 23" x 23", 12" x 12" size