• No.477 Hongxing Road, Xiaoshan Economic Development Zone, Hangzhou
  • hangzhou, Zhejiang,
  • An tSín
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Robotphoenix Wafer Handling Robot

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Based on the pioneering technology of intelligent high-speed parallel delta robot, Robotphoenix invented new 4-DOF parallel semiconductor wafer handling robot of single-platform and dual-platform, which broke through the bottleneck to realize a larger swing angle and higher output speed in multi-closed-loop parallel mechanism. The dual-platform robot angle can reach at least ±180°, and under 0.1kg payload, the fastest travel beat of running in the standard doorframe-shaped trajectory can reach 0.28s. Maximum acceleration is 15g.

Wafer Handling Robot Types

Lobster200Z300S-T0X5-C Wafer Robot

One-armed robot; arm length 200mm;

Payload 0.5kg;

Repositioning accuracy ±0.1mm. Its cleanliness reaches class 100, suitable for atmospheric applications.

Lobster185Z340D-T2X0-C Wafer Robot

Two-armed robot; arm length 185mm;

Payload 2kg;

Repositioning accuracy ±0.1mm. Its cleanliness reaches class 100, suitable for atmospheric applications.

Lobster200Z300S-T0X5-V Wafer Robot

One-armed robot; arm length 200mm;

Payload 0.5kg;

Repositioning accuracy ±0.1mm. Its cleanliness reaches ISO Class1, suitable in a vacuum environment.

Wafer Handling Robot for Specific Environmental Demands

Atmospheric wafer handling robots

Lobster200Z300S-TOX5-C one-armed wafer handling robot and Lobster185Z340D-T2XO-C two-armed wafer transfer robot are suitable for atmospheric applications.

Vacuum-compatible wafer handling robot

Lobster200Z300S-TOX5-V one-armed wafer handling robot fits in a vacuum environment.

Features of Wafer Handling Robot

The wafer handling robot self-developed by Robotphoenix achieves a repositioning accuracy of 3μm, which reaches higher accuracy comparing to other similar products of approximate 20μm. The lobster series wafer handling robots are a type of industrial robots for sale that include single-armed, double-armed, and vacuumed models, and can be used in various semiconductor wafer handling scenarios.